Ahmer Syed: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Robert Darveaux, Jim Heckman, Ahmer Syed, Andrew Mawer

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 828 KB

english, 2000

2

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

Wang, Wei, Zhang, Dingyou, Sun, Yangyang, Rae, David, Zhao, Lily, Zheng, Jiantao, Schwarz, Mark, Shah, Milind, Syed, Ahmer

Year:

2018

Language:

english

File:

PDF, 532 KB

english, 2018

3

Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach

Journal:

Journal of Electronic Packaging

Year:

1995

Language:

english

File:

PDF, 750 KB

english, 1995

4

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Bhatti, Pardeep K., Gschwend, Klaus, Kwang, Abel Y., Syed, Ahmer R.

Journal:

Journal of Electronic Packaging

Year:

1995

Language:

english

File:

PDF, 616 KB

english, 1995

5

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Syed, Ahmer, Kim, Seung Mo, Lin, Wei, Kim, Jin Young, Sohn, Eun Sook, Shin, Jae Hyeon

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.48 MB

english, 2007

6

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of joint size and pad metallization on solder mechanical properties

Darveaux, Robert, Reichman, Corey, Berry, C.J., Wen-Sung Hsu,, Syed, Ahmer, Chang Woo Kim,, Jung Hun Ri,, Tae Seong Kim,

Year:

2008

Language:

english

File:

PDF, 670 KB

english, 2008

7

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Factors affecting Pb-free flip chip bump reliability modeling for life prediction

Syed, Ahmer, Sharon, Gil, Darveaux, Robert

Year:

2012

Language:

english

File:

PDF, 1.56 MB

english, 2012

8

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions

Wang, Wei, Sun, Yangyang, Zhang, Xuefeng, Wang, Lejun, Zhao, Lily, Schwarz, Mark, Stone, Bill, Syed, Ahmer

Year:

2019

File:

PDF, 339 KB

2019

9

[IEEE 2018 IEEE 5th International Conference on Engineering Technologies and Applied Sciences (ICETAS) - Bangkok, Thailand (2018.11.22-2018.11.23)] 2018 IEEE 5th International Conference on Engineering Technologies and Applied Sciences (ICETAS) - Enrichment of Uranium

Younas, Tanzila, Hameed, Sarmad, Sattar, Saud, Quadri, Syed Ahmer Hussain, Saeed, Usman, Modi, Ali Asghar

Year:

2018

Language:

english

File:

PDF, 6 KB

english, 2018

10

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array

Alvarado, Rey, Keser, Beth, Cui, Tong, Syed, Ahmer, Xu, Steven, Roggeman, Brian

Year:

2017

Language:

english

File:

PDF, 703 KB

english, 2017

11

High temperature lead-free solder for microelectronics

Frank W. Gayle, Gary Becka, Ahmer Syed, Jerry Badgett, Gordon Whitten, Tsung-Yu Pan, Angela Grusd, Brian Bauer, Rick Lathrop, Jim Slattery, Iver Anderson, Jim Foley, Alan Gickler, Duane Napp, John Mat

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2001

Language:

english

File:

PDF, 169 KB

english, 2001

12

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition

Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., Batchelor, Bill

Year:

2009

Language:

english

File:

PDF, 927 KB

english, 2009

13

Advanced analysis on board trace reliability of WLCSP under drop impact

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.63 MB

english, 2010

14

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders

Year:

2010

Language:

english

File:

PDF, 249 KB

english, 2010

15

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

Cui, Tong, Syed, Ahmer, Keser, Beth, Alvarado, Rey, Xu, Steven, Schwarz, Mark

Year:

2014

Language:

english

File:

PDF, 1023 KB

english, 2014

16

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Issues in fatigue life prediction model for underfilled flip chip bump

Islam, Nokibul, Syed, Ahmer, Hwang, TaeKyeong, Ka, YunHyeon, Kang, WonJoon

Year:

2011

Language:

english

File:

PDF, 1.78 MB

english, 2011

17

Solar power water distillation unit

Hameed, Kamran, Khan, Muhammad Muzammil, Ateeq, Ijlal Shahrukh, Omair, Syed Muhammad, Ahmer, Muhammad, Wajid, Abdul

Journal:

Journal of Physics Conference Series

Year:

2013

Language:

english

File:

PDF, 599 KB

english, 2013

18

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Quantifying impact of design parameters on Ultra-Low k ILD reliability in fine pitch Cu bump interconnect structures

Bao, Andy, Cui, Tong, Syed, Ahmer, Zhao, Lily, Bezuk, Steve

Year:

2015

Language:

english

File:

PDF, 836 KB

english, 2015

19

Is Altruistic Behavior Associated with Major Depression Onset?

Fujiwara, Takeo, Ahmer, Syed

Journal:

Year:

2009

Language:

english

File:

PDF, 81 KB

english, 2009

20

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Building Accuracies in Finite Element Models for Life Prediction of Solder Joints

Syed, Ahmer, Kim, SeokBong, Lin, Wei

Year:

2007

Language:

english

File:

PDF, 670 KB

english, 2007

21

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging

Hau-Riege, Christine, Keser, Beth, Alvarado, Rey, Syed, Ahmer, Yau, YouWen, Bezuk, Steve, Caffey, Kevin

Year:

2014

Language:

english

File:

PDF, 2.91 MB

english, 2014

22

Conflict of interest in psychiatry

Ahmer, Syed, Arya, Pradeep, Anderson, Duncan, Faruqui, Rafey

Journal:

Psychiatric Bulletin

Year:

2005

Language:

english

File:

PDF, 61 KB

english, 2005

23

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electromigration reliability and current carrying capacity of various WLCSP interconnect structures

Syed, Ahmer, Dhandapani, Karthikeyan, Berry, Christopher, Moody, Robert, Whiting, Riki

Year:

2013

Language:

english

File:

PDF, 2.99 MB

english, 2013

24

What’s in a name?

Journal:

Australian and New Zealand Journal of Psychiatry

Year:

2018

Language:

english

File:

PDF, 45 KB

english, 2018

25

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions

Syed, Ahmer, Lin, Wei, Sohn, Eun-Sook, Cha, Se-Woong

Year:

2007

Language:

english

File:

PDF, 5.82 MB

english, 2007

26

[IEEE 2016 International Conference on Emerging Technologies (ICET) - Islamabad, Pakistan (2016.10.18-2016.10.19)] 2016 International Conference on Emerging Technologies (ICET) - Development of an autonomous flight controller for surveillance UAV

ul Hassan, Mahmood, Ikram, Muhammad Ahmer, Shah, Syed Irtiza Ali

Year:

2016

Language:

english

File:

PDF, 1.12 MB

english, 2016

27

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Relative and absolute warpage modeling on molded packages

Zheng, Jiantao, Zhou, Eric, Wang, Lejun, Aldrete, Manuel, Kumar, Rajneesh, Syed, Ahmer

Year:

2015

Language:

english

File:

PDF, 1.37 MB

english, 2015

28

Pattern of benzodiazepine use in psychiatric outpatients in Pakistan: a cross-sectional survey

Ahmer, Syed, Salamat, Sumera, Khan, Rashid AM, Iqbal, Saleem, Haider, Imran, Khan, Ayesha, Zafar, Mohsan

Journal:

Clinical Practice and Epidemiology in Mental Health

Year:

2009

Language:

english

File:

PDF, 186 KB

english, 2009

29

Prevalence of Mistreatment or Belittlement among Medical Students – A Cross Sectional Survey at a Private Medical School in Karachi, Pakistan

Shoukat, Sana, Anis, Mariam, Kella, Danesh K., Qazi, Fahad, Samad, Fatima, Mir, Faizia, Mansoor, Maryah, Parvez, Mohammad B., Osmani, Bushra, Panju, Sukaina A., Naqvi, Haider, Ahmer, Syed

Journal:

Year:

2010

Language:

english

File:

PDF, 594 KB

english, 2010

30

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Design for board trace reliability of WLCSP under drop test

Tee, Tong Yan, Ng, Hun Shen, Syed, Ahmer, Anderson, Rex, Khoo, Choong Peng, Rogers, Boyd

Year:

2009

Language:

english

File:

PDF, 21.94 MB

english, 2009

31

Guarding the guardians: Bioethics curricula for psychiatrists-in-training in developing countries

Ghias, Kulsoom, Ahmer, Syed

Journal:

International Review of Psychiatry

Year:

2010

Language:

english

File:

PDF, 69 KB

english, 2010

32

[IEEE 2015 International Conference on Information and Communication Technologies (ICICT) - Karachi, Pakistan (2015.12.12-2015.12.13)] 2015 International Conference on Information and Communication Technologies (ICICT) - Implementation of Kano's model in web metrics for information driven websites — KDQI

Ali, Syed Rizwan, Khan, Azmat, Baig, Mirza Muhammad Faisal, Umer, Ahmer

Year:

2015

Language:

english

File:

PDF, 407 KB

english, 2015

33

Does gender influence leadership roles in academic surgery in the United States of America? A cross-sectional study

Battaglia, Frank, Farhan, Syed Ali, Narmeen, Mehek, Karimuddin, Ahmer Azhar, Jalal, Sabeena, Tse, Matthew, Khosa, Faisal

Journal:

International Journal of Surgery

Year:

2020

File:

PDF, 277 KB

2020

34

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear

Wang, Wei, Zhao, Wei, Nakamoto, Mark, Schwarz, Mark, He, Dongming, Zhang, Xuefeng, Zhao, Lily, Syed, Ahmer

Year:

2020

File:

PDF, 601 KB

2020

35

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Factors affecting electromigration and current carrying capacity of FC and 3D IC interconnects

Year:

2010

Language:

english

File:

PDF, 1.79 MB

english, 2010

36

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

Syed, Ahmer, Scanlan, Joan, SeWoong Cha,, WonJoon Kang,, EunSook Sohn,, TaeSeong Kim,, ChangGyun Ryu,

Year:

2008

Language:

english

File:

PDF, 665 KB

english, 2008

37

[IEEE 2009 IEEE International Reliability Physics Symposium (IRPS) - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Package design and material impact on board level reliability of fine pitch packages

Year:

2009

Language:

english

File:

PDF, 87 KB

english, 2009

38

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Lead Free Flip Chip Reliability for Various Package Types

Islam, Nokibul, Jimarez, Miguel, Syed, Ahmer, Hwang, TaeKyeong, Gim, JaeYun, Kang, WonJoon

Year:

2011

Language:

english

File:

PDF, 1.61 MB

english, 2011

39

MBCL-25. OUTCOME OF CHILDREN WITH MEDULLOBLASTOMA AT TERTIARY CARE HOSPITAL IN PAKISTAN

Hamid, Syed Ahmer, Dawson, Maria Idrees, Khan, Rahil, Ashraf, Muhammad Shamvil, Qaddoumi, Ibrahim

Journal:

Year:

2018

Language:

english

File:

PDF, 81 KB

english, 2018

40

Association between antipsychotics and weight gain among psychiatric outpatients in Pakistan: a retrospective cohort study

Syed Ahmer, Rashid AM Khan, Saleem Perwaiz Iqbal

Journal:

Annals of General Psychiatry

Year:

2008

Language:

english

File:

PDF, 158 KB

english, 2008

41

Benzodiazepine use among adults residing in the urban settlements of Karachi, Pakistan: A cross sectional study

Saleem P Iqbal, Syed Ahmer, Salima Farooq, Yasmin Parpio, Ambreen Tharani, Rashid AM Khan, Mohammad Zaman

Journal:

Substance Abuse Treatment, Prevention, and Policy

Year:

2011

Language:

english

File:

PDF, 233 KB

english, 2011

42

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

Syed, Ahmer, Dhandapani, Karthikeyan, Moody, Robert, Nicholls, Lou, Kelly, Mike

Year:

2011

Language:

english

File:

PDF, 878 KB

english, 2011

43

Arising Sales force Motivation Due to Organizational Justice

Manzoor, Sheikh Raheel, Naveed, Ahmer, Shah, Syed Habib

Journal:

International Journal of Learning and Development

Year:

2012

File:

PDF, 295 KB

2012

44

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish

Syed, Ahmer, Kim, Tae-Seong, Cha, Se-Woong, Scanlon, Joan, Ryu, Chang-Gyun

Year:

2007

Language:

english

File:

PDF, 3.75 MB

english, 2007

45

Medicines policy issues for Saudi Arabia: priorities and model

Mirza, Ahmer Hameed, Hasan, Syed Shahzad, El‐Dahiyat, Faris, Babar, Zaheer‐Ud‐Din

Journal:

Journal of Pharmaceutical Health Services Research

Year:

2019

Language:

english

File:

PDF, 146 KB

english, 2019

46

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Warpage Variation Analysis and Model Prediction for Molded Packages

Niu, Yuling, Wang, Wei, Wang, Zhijie, Dhandapani, Karthik, Schwarz, Mark, Syed, Ahmer

Year:

2019

Language:

english

File:

PDF, 613 KB

english, 2019

47

Psychiatric rating scales in Urdu: a systematic review

Syed Ahmer, Rafey A Faruqui, Anita Aijaz

Journal:

Year:

2007

Language:

english

File:

PDF, 517 KB

english, 2007

48

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish

Syed, Ahmer, Kim, Tae, Cho, Young, Kim, Chang, Yoo, Min

Year:

2006

Language:

english

File:

PDF, 383 KB

english, 2006

49

Well-being of medical students and their awareness on substance misuse: a cross-sectional survey in Pakistan

Abdul Wahab Yousafzai, Syed Ahmer, Ehsanullah Syed, Naila Bhutto, Saman Iqbal, Mohammed Naim Siddiqi, Mohammed Zaman

Journal:

Annals of General Psychiatry

Year:

2009

Language:

english

File:

PDF, 176 KB

english, 2009

50

Cost-Effectiveness of an Opportunistic Screening Programme and Brief Intervention for Excessive Alcohol Use in Primary Care

Tariq, Luqman, van den Berg, Matthijs, Hoogenveen, Rudolf T., van Baal, Pieter H. M., Ahmer, Syed

Journal:

Year:

2009

Language:

english

File:

PDF, 366 KB

english, 2009

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски